You are here: Welcome » RAND Corporation

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
Next revision
Previous revision
Both sides next revision
rand_corporation [2021/12/21 20:25]
liam
rand_corporation [2021/12/21 20:32] (current)
liam
Line 92: Line 92:
  
   * "Many of the most controversial TAs involve biotechnology—for example, GM crops, GM insects, **genetic screening, gene therapy, and genetic selection of offspring**. Other TAs spark heated debate because of their **potential implications for personal privacy and freedom**. These include **pervasive sensors**, certain uses of **RFID implants for tracking and identification of people**, **chip implants for the brain**, and **biometrics as sole personal identification**. **Genetic screening** is a biotechnology application that also raises privacy concerns. For example, **would individuals with certain genetic characteristics and established links to certain types of disease and illness be denied health insurance or jobs, or face other forms of discrimination?**"   * "Many of the most controversial TAs involve biotechnology—for example, GM crops, GM insects, **genetic screening, gene therapy, and genetic selection of offspring**. Other TAs spark heated debate because of their **potential implications for personal privacy and freedom**. These include **pervasive sensors**, certain uses of **RFID implants for tracking and identification of people**, **chip implants for the brain**, and **biometrics as sole personal identification**. **Genetic screening** is a biotechnology application that also raises privacy concerns. For example, **would individuals with certain genetic characteristics and established links to certain types of disease and illness be denied health insurance or jobs, or face other forms of discrimination?**"
 +
 +**Nanotechnology for tracking and control**
 +
 +  * "...the growth rate has been achieved by a continual progression to increasingly more-dense complementary metal-oxide semiconductor (CMOS) chip fabrication technologies."
 +  *  "Current commercial fabrication methods are already at the nanoscale, with nominal feature size of 90 nanometers and gate width of 50 nanometers, and approaches to scale down to 10 nanometers feature size are under research."
 +  * "However, by 2020, the continued reduction of feature size is likely to require nonconventional and hybrid methods; several different approaches (e.g., based on nanotubes, nanowires, and molecular switches) have been suggested and are being pursued."
Back to top